通信工程文献翻译——摘要：在本文中，我们通过使用智能控制理论和系统级模型开发一个高性能、低成本的光电对齐和装的自动化的技术。控制回路的设计是基于先前推广过程和其他控制行业的模式控制。该方法建立一个先验知识模型，是基于特定的组合包装的光功率传播特性和和使用其设定初始的“前馈”条件的自动化系统。除了这个前馈模式，该控制器的设计包含了由反馈元件组成的光学功率传感器。光学建模采用严谨标量平面波构想，有效地解决了online使用角谱问题。使用以知识为基础的控制技术所带来的好处之一是可以增大自动化过程的效率值，同时，减少了随着数量的对齐步骤。该技术的一个额外的好处是可以减少由光学部件间的连线引发功率最大值，而不是全局最大的功率分配的可能性。因此，该技术提高了系统性能，降低自动化的过程的综合成本。

索引术语——光学微系统指标、光学建模与仿真、包装、光子自动化。

II.光子自动化生产过程中

在详细介绍我们的自动化过程之前，我们首先呈现的是当前的行业最先进的自动化过程及显示光子技术存在的局限性。从业绩与潜力来讨论，我们的技术经济优势是显而易见的。

A：目前最先进的光子自动化进程

在图1中，我们为当前光子装置提出了一个制造自动化过程的流程图。我们为每一个步骤提供简短精细的描述。在第一步中，这个设备以自动化的方式被挑选、放置。通过使用精密装置加工和高放大倍数视频的反馈，可以获得插入重现性好，无损害纤维的纤维阵列和波导。第二步，光检测和粗对齐方式可以通过使用相机的视觉系统和信号处理来定位光纤和装置的位置。第三步，控制和优化，细致的调节对其方式的位置。这一步在下一节中详细讨论，因为它是我们的自动化过程的关键。第四步，贴合，是应用具有专业等级和用户专用的光学粘合剂。是通过一个时间脉冲或容积注入胶粘剂分配器。UV辐射校准是通过双光纤反射来固化。第5步，post-bonding测试用，最终吞吐量测量验证结合质量和装置质量。最后，第6步，设备和卸载。在图1，阴影盒......

Abstract—In this paper, we present an automation technique that yields high-performance, low-cost optoelectronic alignment and packaging through the use of intelligent control theory and system-level modeling. The control loop design is based on model-based control, previously popularized in process and other control industries. The approach is to build an a priori knowledge model, pecific to the assembled package’s optical power propagation characteristics, and use this to set the initial “feed-forward” conditions of the automation system. In addition to this feed-forward model, the controller is designed with feedback components, along with the inclusion of a built in optical power sensor. The optical modeling is performed with the rigorous scalar Rayleigh–Sommerfeld formulation, efficiently solved online using an angular spectrum technique. One of the benefits of using a knowledge-based control technique is that the efficiency of the automation process can be increased, as the number of alignment steps can be greatly reduced. An additional benefit of this technique is that it can reduce the possibility that attachment between

optical components will occur at local power maximums, instead of the global maximum of the power distribution. Therefore,the technique improves system performance, while reducing the overall cost of the automation process.

Index Terms—Alignment, optical microsystems, optical modeling and simulation, packaging, photonic automation.

I. INTRODUCTION

T HE current trend in optical microsystem design is to exploit advanced devices and new system architectures to achieve greater system performance, such as higher data rates or brighter displays. However, to push toward the theoretical limits of optical microsystems, accurate alignment and packaging of the multidomain system is required. Packaging is a challenging problem, as systems are typically manually aligned. This technique is labor intensive, slow, and can lead to poor performance of the system. Even with the recent progress in the development of devices and microsystems, the packaging and assembly of these systems remains as the possible critical limiting factor to commercial success. These problems, compounded with the current economic struggles of the telecommunication community, result in a high cost to develop, prototype, and commercialize the next generation of optical microsystems.

Automation is the key to high-volume, low-cost, and high-consistency manufacturing, while ensuring performance,reliability, and quality. There is a growing interest in the......