通信工程文献翻译——随着越来越多的无线技术能够从市场上直接获得，人们要求自动获得最有效的设备和服务，让事情变得简单、需花费很多额外的钱，并且能够广泛应用是客户所渴望的。透过终端用户的要求，我们把视角转移到技术细节上，事情并不是我们想象的那么简单。

作为集成电路的制造者，影响他们的只要是这么一个简单的题目。那就是：缺乏行业技术标准的技术随着社会的需求往各个方面发展（如无线局域网标准、蓝牙技术）并且他们影响到了后续产品的设计和制造，这些技术的发展影响到了市场的需求。

从发展趋势看，标准和技术的革新在将来几个月将围绕如下几个方面影响无线集成电路的制造：

1.测量与控制和数字技术以及实现这些技术的设备将支持无标准功能，比如MP3等；

2.射频电路、混合信号传输和接受信道，以及支持高水平集成技术降低了设备成本，并且在原理上为多模多和多波段操作提供了可能；

3.硅技术要求与支持高度集成，并且没有冒险的低能源消耗。

毫不怀疑，他们的目标是一块简单的能够自适应相容所有标准的互补金属氧化物半导体（CMOS）芯片。如果说这是最后的目标，那我们必须首先确定我们在信道指示这方面已经是正确的。如果无线射频标准未能建立，互补金属氧化物半导体技术的全部潜能在近期很难完全开发出来，同一个模型上的原有的射频电路和数字系统噪声已经被证实能够应用适当的电路技术、特殊的构造和对底层数字噪声幅度的构造和研究实现优化。总之，多波段无线电技术要求考虑大量的值得考虑的环境模型以及元器件排列造成的消极成分。这个通常被称为影响创造一个新的传输结构、基于复杂射频传输网络和高速组建模型技术。总之，互补金属氧化物半导体使技术发展到了高时钟频率（减少了射频网络的尺寸的消极影响）。并且，高速度提供了其他抵消在电路......

As more and more wireless technologies become available in the marketplace (making them almost ubiquitous), users are demanding devices and services that automatically use the best available technology. Making things simpler, cheaper, and widely available are really what consumers are striving for. As we move into the technical details behind what end-users are asking for, things are not always as easy as they seem. 

For wireless IC manufacturers, the main impact revolves around a single theme. That is, the movement of historically non-standard functions into cell phones (think Wi-Fi/VOIP, Bluetooth) and their impact in the design of the end product and the technology roadmap associated with those to achieve market demand. 

The emerging trends, standards, and technological innovations that will affect wireless IC makers in the month ahead revolve around the:

MAC and digital baseband and the ability of those devices to support non-standard functionality, such as MP3. 

RF and mixed-signal transmit and receive path and the support of higher integration levels to reduce cost/price and form factor while enabling multi-mode and multi-band operations. 

Silicon technology requirements to support higher integration levels without jeopardizing lower power consumption. 

There's no doubt that the goal is a single-chip CMOS solution that's compatible with all standards and is capable of adapting itself. If this is the......